We are proud to announce that 3DiS Technologies has been selected to participate to SEMICON Europa INNOVATION Village. The INNOVATION Village at SEMICON Europa will showcase a selection of the most innovative start-ups as well as new innovative technologies ready for industrial transfer in an open platform setting.

Innovation Village will showcase both start-ups and technologies from:

• Materials for semiconductors & electronics including Flexible Materials
• Equipment for electronics manufacturing
•  Micro- and nanotechnologies
• Electronics for MedTech, Cleantech, and Automotive

3DiS Technologies’ CEO Ayad GHANNAM will present Confromal Peripheral 3D Interconnect Technology, enabler of advanced 3D system packaging and 3D IPD, on October 25th, at 16:20 during Micro & Nano Session, Innovation Village Area, Alpexpo.

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