3DiS Technologies presented “Ultra-thin QFN-Like 3D Package with 3D Integrated Passive Devices” paper at The 69th Electronic Components and Technology Conference (ECTC) 2019 that was held in Las Vegas. The work presented in this paper was the fruit of successful collaboration between 3DiS Technologies, NXP France, Besi Netherlands, Besi Austria and EV Group under the EuroPAT-MaSiP project. The developed novel process enables 3D system and 3D high-Q inductor integration inside an ultra-thin (200um) package using 3DiS’s proprietary 3D-RDL technology and laser debonding as well as advanced die placement and thin-cap molding.

This project has received funding from the ECSEL JU under grant agreement No 737497. The ECSEL JU is supported by the European Union’s Horizon 2020 research and innovation programme and by national programmes of Austria, Finland, France, Germany, Hungary, Ireland, Netherlands, Portugal, and Sweden.

The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). The 2019 ECTC was held May 28 –May 31, 2019, at The Cosmopolitan of Las Vegas, Nevada, USA. This premier international conference, sponsored by the IEEE Electronics Packaging Society (IEEE EPS), covers a wide spectrum of electronic packaging technology topics, including components, materials, assembly, interconnect design, device and system packaging, wafer level packaging, Si photonics, LED and IoT, optoelectronics, 2.5D and 3D integration technology, and reliability.

http://ectc.net
 
EuroPAT-MASIP – Reinforcing the European semiconductor industry

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