Ayad GHANNAM, 3DiS Technologies CEO presented “3D-RDL and Conformal High Aspect Ratio Pre-formed TPVs for RDL-First Type FO-Packages: Enabler of Advanced 3D Wafer-level System Packaging for 5G Applications” at SEMI’s 3D & System Summit. Nowadays, RF communication modules are integrated in an increasing number of electronic devices. With the tight requirements of 5G applications, these […]
3DiS Technologies presented “Ultra-thin QFN-Like 3D Package with 3D Integrated Passive Devices” paper at The 69th Electronic Components and Technology Conference (ECTC) 2019 that was held in Las Vegas. The work presented in this paper was the fruit of successful collaboration between 3DiS Technologies, NXP France, Besi Netherlands, Besi Austria and EV Group under the […]
3DiS Technologies, lauréate de l’édition 2018 du concours Occitanie Invest a pitché devant des investisseurs venus de toute la France. Elle cherche à lever des fonds pour financer l’industrialisation des ses innovations de packaging 3D de systèmes électroniques ainsi que son développement commercial.
We are proud to announce that 3DiS Technologies has been selected to participate to Eurosatory LAB, a new zone dedicated to start-ups! We will be pleased to meet with you at our booth #40, Hall 5A, and discuss about our latest innovations and your needs. We invite you also to attend to our company’s […]