3DiS Technologies Dielectric-core-based HAR Thru-Package-Vias forming using 3D-RDL won the 3DInCites “Process of the Year” Award. The competition in this category was with Xperi, Plan Optik, CEA-Leti and YES. It is great to see 3DiS Technologies recognized for one of its innovative, 3D-RDL-based, advanced 3D Wafer-Level-Packaging technology solution. This technology enables innovation in advanced 3D […]
Ayad GHANNAM, 3DiS Technologies CEO presented “3D-RDL and Conformal High Aspect Ratio Pre-formed TPVs for RDL-First Type FO-Packages: Enabler of Advanced 3D Wafer-level System Packaging for 5G Applications” at SEMI’s 3D & System Summit. Nowadays, RF communication modules are integrated in an increasing number of electronic devices. With the tight requirements of 5G applications, these […]
Ultra-thin QFN-Like 3D Package with 3D Integrated Passive Devices paper presented at 69th ECTC 2019, in Las Vegas was featured in Passive Components News. The article effectively highlights the key advantages of the new package “This result showed the 3D integration capability of this concept, making it suitable for RF 3D wafer-level system-in-packages. The package […]
3DiS Technologies presented “Ultra-thin QFN-Like 3D Package with 3D Integrated Passive Devices” paper at The 69th Electronic Components and Technology Conference (ECTC) 2019 that was held in Las Vegas. The work presented in this paper was the fruit of successful collaboration between 3DiS Technologies, NXP France, Besi Netherlands, Besi Austria and EV Group under the […]