2017 3D InCites Awards Vote 3DiS Technologies is nominated for 3D InCites “Start-up of the Year” award. You are welcomed to connect to https://www.3dincites.com/3d-incites-awards/2017-3d-incites-awards-vote/ and vote for our start-up. You may vote one time in a 24 hour period. The 3D InCites Awards were established in 2013 to acknowledge companies who were instrumental in bringing […]
3DiS Technologies will be presenting “Wafer-level 3D system packaging of IoT devices enabled by conformal 3D Interconnects” during startup pitch session. Kindly attend our presentation the 27th of June at 4:30 pm. SiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs – market trends, system integration/miniaturization, […]
3DiS Technologies team would like to thank all of you who visited our stand at Semicon Europa 2016 ! Thanks to you, our exhibition was a big success! We are looking forward to do a very successful business with you. We also would like thank SEMI for giving us the opportunity to exhibit at […]
We are proud to announce that 3DiS Technologies has been selected to participate to SEMICON Europa INNOVATION Village. The INNOVATION Village at SEMICON Europa will showcase a selection of the most innovative start-ups as well as new innovative technologies ready for industrial transfer in an open platform setting. Innovation Village will showcase both start-ups […]