3DiS Technologies will present and exhibit at SEMICON Europa 2016 which is held from Oct 25-27 in Alpexpo, Grenoble, France. Come meet us at our booth IV18 in Innovation Village! We are looking forward to exchanging with you.
3DiS Technologies is attending and presenting at European 3D TSV Summit, Grenoble from January 18 to 20. Ayad GHANNAM, CEO, invites you to kindly attend our Startup pitch: Jan/19 at 17H40.
3DiS Technologies is attending and presenting at EMPC 2015 from September 14 to 16. We invite you to kindly attend our talk: Sep/16 at 10:00 am – Session 8.1: Challenges in 2.5D and 3D Packages.