Electronic Components and Technology Conference (ECTC) 2018
3DiS Technologies will be presenting “Ultra-Compact, High-Performance, 3D-IPD Integrated using Conformal 3D Interconnects” paper at The Electronic Components and Technology Conference (ECTC) 2018. Kindly attend to our CEO’s Ayad GHANNAM presentation the 31st of May at 3:55 pm in Session 23: RF and THz Module Components. The Electronic Components and Technology Conference (ECTC) is […]