News & Upcoming Events

01 Feb

3DiS Technologies presented at SEMI’s 3D & System Summit in Dresden (2020)

3d interconnects · 3D packaging · 3D Systems Summit · 3d-rdl · 3DiS · 5G · QFN-like · Semi · system-in-package | Events

Ayad GHANNAM, 3DiS Technologies CEO presented “3D-RDL and Conformal High Aspect Ratio Pre-formed TPVs for RDL-First Type FO-Packages: Enabler of Advanced 3D Wafer-level System Packaging for 5G Applications” at SEMI’s 3D & System Summit. Nowadays, RF communication modules are integrated in an increasing number of electronic devices. With the tight requirements of 5G applications, these […]

Jun

System-in-Package (SiP) Conference 2017

3d interconnects · 3d-rdl · 3DiS · imaps · sip · system-in-package | Events

3DiS Technologies will be presenting “Wafer-level 3D system packaging of IoT devices enabled by conformal 3D Interconnects” during startup pitch session. Kindly attend our presentation the 27th of June at 4:30 pm. SiP 2017 is the first System-in-Package (SiP) conference fully dedicated to covering all aspects related to SiPs – market trends, system integration/miniaturization, […]

News & Upcoming Events

01

Feb

3DiS Technologies presented at SEMI’s 3D & System Summit in Dresden (2020)

22

Jun

System-in-Package (SiP) Conference 2017

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