Ultra-thin QFN-Like 3D Package with 3D Integrated Passive Devices paper presented at 69th ECTC 2019, in Las Vegas was featured in Passive Components News. The article effectively highlights the key advantages of the new package “This result showed the 3D integration capability of this concept, making it suitable for RF 3D wafer-level system-in-packages. The package concept was used to produce a prototype with an RF device inside, improving electrical performance compared to wire-bond based solutions through short 3D interconnects and improving thermal dissipation compared to flip-chip based solutions by spreading heat through the PCB.“.

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